Custom Spring Test Probes Manufacturers & Suppliers

For high-current applications (typically exceeding 5A and up to 30A), we recommend Beryllium Copper (BeCu) plungers due to their excellent electrical conductivity and mechanical strength. Additionally, integrating internal ball designs or bias-plunger mechanisms ensures continuous contact between the plunger and the inner barrel wall, minimizing resistance and heat generation.

Gold plating prevents oxidation and ensures a stable electrical connection. Thicker gold layers (e.g., 20u" to 50u") increase wear resistance over high insertion cycles. In environment-intensive tests (like thermal or saline testing), thicker plating prevents base-metal diffusion, keeping contact resistance below 30mΩ over the lifetime of the probe.

For PCBs with potential solder flux residue, oxide layers, or contamination, we recommend using serrated, chisel, or spear-tip shapes. These geometries concentrate spring force onto sharp edges, allowing the probe to pierce through thin surface contamination to establish reliable contact.

Yes. RF and high-frequency testing require controlled impedance (typically 50 ohms). We design custom coaxial probes that incorporate internal shielding and specific dielectric materials, minimizing return loss and signal attenuation up to 6 GHz and beyond.

Custom probe prototyping typically takes 7 to 10 working days for tooling and sample preparation, depending on the complexity of the tip shape and housing design. High-volume production typically requires 2 to 3 weeks following sample approval.

We use high-precision testing equipment in our quality control lab, including video measuring systems, dynamic contact resistance testers, force-stroke testers, and X-ray fluorescence plating thickness analyzers. Each batch undergoes rigorous testing to verify spring force tolerances, dimensional accuracy, and plating specifications.